● FEATURES 特性
1. High common mode impedance at high frequency effects excellent noise suppression performance.
高频共模阻抗高，噪声抑制性能优良.
2.20Ω~2000Ω are optional for different noise level and signal frequency
对于不同的噪声电频和信号频率，选择20Ω~2000Ω阻抗.
● APPLICATIONS 用途
1. USB 2.0 line for personal computers and peripheral
电脑和外围设备的USB 2.0线路.
2. IEEE 1394 line for personal computers, DVC, STB
用于计算机、DVC、机顶盒的IEEE 1394线路.
3. LVDS, panel line for liquid display panels, graph card,etc. LVDS，用于液体显示面板的面板线，图形卡等.
● PART NUMBERING SYSTEM 品名系统
A: Type 型号 B: External Dimensions 外形尺寸 A*C
C: Material type 材料类型 D: Impedance Value 阻抗值 900 = 90Ω
E: Number of line 2P : 2-Line 双线 F: Packaging : T=Taping and reel
● SHAPES AND DIMENSIONS 外形尺寸 (Unit:mm)
TYPE(型号) | A | B | C | D1 | D2 | E | F | G | H | K |
YZXMC1210S | 1.2±0.2 | 0.8±0.1 | 1.0±0.2 | 0.33 Ref | 0.36 Ref | 0.1 Max | 1.0 Ref | 0.3 Ref | 0.5 Ref | 1.55 Ref |
● STRUCTURE AND MATERIAL
● ELECTRICAL CHARACTERISTICS
1. Operating temperature range : -40℃～85℃(Including self - temperature rise)
2. Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.)
● TEST AND MEASUREMENT PROCEDURES
1. Common Mode Impedance(Ω)
Test equipment: Keysight E4991B / Agilent 4787A or equivalent
2. DC Resistance (DCR)
Test equipment: Agilent34420A / Agilent 4338B or equivalent
3. Rated Current (Irms)
Irms is direct electric current as chip surface temperature rose just 40 against chip initial surface temperature (Ta)
4. Insulation Resistance
Test equipment: Chroma or equivalent TH2683A / ZX6583
● RECOMMENDED SOLDERING TECHNOLOGIES
Re-flowing Profile
Preheat condition: 150~200 /60~120sec. Allowed time above 217C: 60~90sec.
Max temp: 260
Max time at max temp: 10sec Solder paste: Sn/3.0Ag/0.5Cu Allowed Reflow time: 2 times max
● SPECIFICATION TABLE:
YZXMC1210S Series
Part No. | Common Mode Impedance(Ω) | Test Frequency (MHz) | DCR (Ω) Max | Max. Rated Current (mA) | Rated Voltage (Vdc) | Insulation Resistance (MΩ) Min. |
YZXMC1210S-200-2P-T | 20±25% | 100 | 0.15 | 500 | 20 | 10 |
YZXMC1210S-350-2P-T | 35±25% | 100 | 0.18 | 430 | 20 | 10 |
YZXMC1210S-600-2P-T | 60±25% | 100 | 0.30 | 400 | 20 | 10 |
YZXMC1210S-900-2P-T | 90±25% | 100 | 0.30 | 400 | 20 | 10 |
YZXMC1210S-161-2P-T | 160±25% | 100 | 0.40 | 260 | 20 | 10 |
YZXMC1210S-201-2P-T | 200±25% | 100 | 0.40 | 250 | 20 | 10 |
YZXMC1210S-361-2P-T | 360±25% | 100 | 0.55 | 250 | 20 | 10 |
1. Operating temperature range : -40℃～85℃(Including self - temperature rise)
2. Storage temperature range (packaging conditions): -10℃~+40℃ and RH 70% (Max.)
3. Rated Current (Irms)
Irms is direct electric current as chip surface temperature rose just 40 against chip initial surface temperature (Ta)
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